Molding Process Flow

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BMC Compression Molding Process

Material preparation

Material preparation

Mold preheating

Mold preheating

Charge placement

Charge placement

Compression under heat and pressure (130–160°C, 2–5 min)

Compression under heat and pressure (130–160°C, 2–5 min)

Cure

Cure

Demold

Demold

Deflash

Deflash

SMC Compression Molding Process

Cutting SMC sheet material

Cutting SMC sheet material

Stacked and placed in the mold cavity

Stacked and placed in the mold cavity

Mold closing pressure heating (130-160 ℃, 3-6 min)

Mold closing pressure heating (130-160 ℃, 3-6 min)

Cure

Cure

Demold

Demold

Deflash

Deflash

Phenolic Compression/Transfer Molding Process

Mold preheating (150-180 ℃)

Mold preheating (150-180 ℃)

Input phenolic molding compound (granules/powders)

Input phenolic molding compound (granules/powders)

Mold closing pressure heating

Mold closing pressure heating

Curing reaction (releasing water vapor/formaldehyde, requiring exhaust)

Curing reaction (releasing water vapor/formaldehyde, requiring exhaust)

Demold

Demold

Post curing (optional)

Post curing (optional)

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